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Analysis of a flip-chip bonded tunable high-temperature superconducting coplanar waveguide resonator using the conformal mapping technique

机译:使用保形映射技术分析倒装芯片键合可调高温超导共面波导谐振器

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We have studied the tuning properties of a high-temperature superconducting (HTS) half-wavelength coplanar waveguide (CPW) resonator operating at 5 GHz. The tuning schemes are based on flip-chip bonding of an electrically tunable ferroelectric (FE) thin film and a mechanically movable Tow-loss single crystal on top of the resonator. Using the conformal mapping method, closed-form analytical expressions have been derived for a flip-chip bonded conductor-backed and top-shielded CPW transmission line. The obtained expressions are used to analyse the volume effect of the FE thin film and the gap between the flip-chip and the CPW resonator on the tuning properties of the device. It has been found that large frequency modulation of the resonator produces impedance mismatch, which can considerably enhance the insertion loss of high-performance HTS microwave devices. Analysis also suggests that, for electrically tunable devices, flip-chip bonded FE thin films on HTS CPW devices provide a relatively higher performance compared to bilayer HTS/FE tunable devices.
机译:我们已经研究了工作在5 GHz的高温超导(HTS)半波长共面波导(CPW)谐振器的调谐特性。调谐方案基于谐振器顶部的电可调铁电(FE)薄膜和可机械移动的拖曳损耗单晶的倒装芯片接合。使用保形映射方法,已经得出了倒装芯片键合导体支持和顶部屏蔽的CPW传输线的闭式分析表达式。获得的表达式用于分析FE薄膜的体积效应以及倒装芯片和CPW谐振器之间的间隙对器件调谐特性的影响。已经发现,谐振器的大频率调制会产生阻抗失配,这会大大增加高性能HTS微波设备的插入损耗。分析还表明,对于电可调器件,与双层HTS / FE可调器件相比,HTS CPW器件上的倒装芯片键合FE薄膜可提供相对较高的性能。

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