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Effect of RF and microwave oxygen plasma on the performance of Pd gate MOS sensor for hydrogen

机译:射频和微波氧等离子体对Pd栅极MOS氢性能的影响

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The combined effect of microwave and RF oxygen plasma treatment of SiO_2 surface on the hydrogen sensitivity of Pd gate MOS sensor has been studied. Nine different samples of thermally grown SiO_2 surface have been taken and treated with oxygen plasma of different microwave power (100 W, 150 W and 200 Wrespectively) while keeping RF power fixed (20 W) for different durations (5 min, 10 min and 15 min). Pd gate MOS sensors with these plasma treated SiO_2 surface as dielectric have been fabricated and tested for different concentrations (500-3500 ppm) of hydrogen at room temperature. It is observed that the sensitivity of the sensor increases for higher duration of plasma exposure and also with microwave power but decreases when the sensor is treated with 200 W microwave power for 10 min and 15 min durations. The sensor treated with oxygen plasma of 200 W microwave power for 5 min duration exhibited the highest hydrogen sensitivity (74.4%). Fixed oxide charge density has also been evaluated as a function of exposure time for varying microwave power. Surface morphology of plasma treated SiO_2 surfaces was studied by AFM to have the estimation of porosity. The high sensitivity can be attributed to the fact that oxygen plasma treatment provides the availability of higher number of adsorption sites and modification in the surface state density i.e. surface state density increases for plasma treated sensors.
机译:研究了微波和射频氧等离子体处理SiO_2表面对Pd栅MOS传感器氢敏感度的联合作用。已采集了9个不同的热生长SiO_2表面样品,并分别用了不同微波功率(分别为100 W,150 W和200 W)的氧等离子体进行处理,同时在不同的持续时间(5分钟,10分钟和15分钟)保持RF功率固定(20 W)。分钟)。已经制造了以这些经过等离子体处理的SiO_2表面作为电介质的Pd栅极MOS传感器,并在室温下测试了不同浓度(500-3500 ppm)的氢气。可以观察到,随着等离子体暴露时间的延长以及微波功率的增加,传感器的灵敏度会提高,但是当使用200 W微波功率的传感器处理10分钟和15分钟的时间时,传感器的灵敏度会降低。用200 W微波功率的氧等离子体处理5分钟的传感器表现出最高的氢敏感度(74.4%)。固定氧化物电荷密度也已根据暴露时间的变化进行了评估,以改变微波功率。通过原子力显微镜研究了等离子体处理的SiO_2表面的表面形貌,以估计孔隙率。高灵敏度可归因于以下事实:氧等离子体处理提供了更多数量的吸附位点,并且表面状态密度发生了变化,即等离子体处理传感器的表面状态密度增加。

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