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首页> 外文期刊>Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion >Industrial high performance crystalline silicon solar cells and modules based on rear surface passivation technology
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Industrial high performance crystalline silicon solar cells and modules based on rear surface passivation technology

机译:基于背面钝化技术的工业高性能晶体硅太阳能电池和组件

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Stimulated by the extreme market conditions, the increase in performance and the reduction of manufacturing costs of standard crystalline silicon solar cells and modules have been quite significant in the last years. This progress was achieved mainly by process and material improvements avoiding additional process complexity. As todays cells are predominantly limited by optical and recombination losses at the rear surface, dielectric rear surface passivation represents an obvious approach to overcome the limitations. In recent years several concepts have been developed to implement dielectric rear side passivation into industrial-scale mass production. In this paper a short review is given about the evolution of dielectric rear side passivation technologies as well as on state-of-the-art cell and module results. Simple and cost effective cell and module designs utilizing standard as well as innovative manufacturing technologies are presented. Furthermore, it is shown that for all major steps multiple process options are available to further reduce the manufacturing costs. Using an optimized emitter and screen-printed metallization on commercially available 156 mm x 156 mm p-type Czochralski-grown crystalline silicon wafers best cell efficiencies of 19.9% without dielectric rear surface passivation and 21.0% with dielectric rear surface passivation are demonstrated. Replacing the screen-printed front contacts by electroplated nickel-copper contacts record efficiencies of up to 21.3% are reached. By optimizing the module design and materials to reduce the resistive and optical losses, a peak module power of up to 306 W and 19.5% aperture area efficiency are achieved.
机译:在极端的市场条件的刺激下,标准晶体硅太阳能电池和模块的性能提高和制造成本的降低在最近几年中已经非常显着。该进展主要是通过工艺和材料改进来避免额外的工艺复杂性而实现的。由于当今的电池主要受到背面的光学和复合损耗的限制,因此电介质背面的钝化是克服这些局限性的一种明显方法。近年来,已经开发出一些概念以将电介质背面钝化实施到工业规模的批量生产中。本文简要回顾了电介质背面钝化技术的发展以及最新的电池和模块结果。介绍了利用标准以及创新制造技术的简单且经济高效的电池和模块设计。此外,显示出对于所有主要步骤,多个工艺选择可用以进一步降低制造成本。在市场上可买到的156 mm x 156 mm p型切克劳斯基生长的晶体硅晶片上使用优化的发射极和丝网印刷的金属化层,在没有电介质后表面钝化的情况下,最佳电池效率为19.9%,在电介质后表面钝化条件下的最佳电池效率为21.0%。用电镀镍-铜触点代替丝网印刷的前触点,记录效率高达21.3%。通过优化模块设计和材料以减少电阻和光学损耗,可实现高达306 W的峰值模块功率和19.5%的孔径面积效率。

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