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Gas expanded polymer process to anneal nanoparticle dispersion in thin films

机译:气体膨胀聚合物工艺用于退火纳米粒子在薄膜中的分散

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摘要

Organic photovoltaic (OPV) active layers made by spin-coating a solution comprising poly(3-hexylthiophene) (P3HT) and phenyl-C61-butyric acid methyl ester (PCBM) nanoparticles have been shown to adopt a non-uniform concentration profile across the thin film dimension. This inhomogeneous distribution can reduce the efficiency of the device. In the present work a new process, gas expanded polymer (GXP) annealing, is applied to P3HT/PCBM thin film blends, enabling the distribution of the PCBM nanoparticles to be manipulated by varying the GXP processing conditions. Films of 50 nm thickness (nominally) created by spin casting a blend of P3HT mixed with PCBM were annealed by oscillatory GXP and GXP at constant pressure using high pressure CO2. An increase in P3HT crystallinity (detected by X-ray diffraction and UV-vis spectroscopy) along with a more uniform distribution of PCBM nanoparticles in the thickness dimension, as interpreted from neutron reflectivity measurements, were observed after oscillatory GXP annealing. In addition, static water contact angles suggest that the film/air interface is enriched in PCBM relative to the as-cast film. These results demonstrate that GXP annealing, which is commercially scalable, can be successfully used to create a uniform distribution of PCBM nanoparticles across the thickness dimension in a P3HT thin film. (C) 2015 Elsevier B.V. All rights reserved.
机译:通过旋涂包含聚(3-己基噻吩)(P3HT)和苯基-C61-丁酸甲酯(PCBM)纳米颗粒的溶液制得的有机光伏(OPV)活性层已显示出在整个表面上采用非均匀的浓度分布薄膜尺寸。这种不均匀的分布会降低设备的效率。在当前的工作中,一种新的工艺,即气体膨胀聚合物(GXP)退火被应用于P3HT / PCBM薄膜共混物,从而可以通过改变GXP加工条件来控制PCBM纳米颗粒的分布。通过旋转浇铸P3HT与PCBM的混合物制成的(名义上)厚度为50 nm的薄膜通过振荡GXP和GXP在恒定压力下使用高压CO2进行退火。振荡GXP退火后,观察到P3HT结晶度的增加(通过X射线衍射和UV-vis光谱检测)以及PCBM纳米颗粒在厚度方向上更均匀的分布(从中子反射率测量得出)。另外,相对于铸态薄膜,静态水接触角表明薄膜/空气界面的PCBM含量更高。这些结果表明,商业上可扩展的GXP退火可以成功地用于在P3HT薄膜的整个厚度方向上创建PCBM纳米颗粒的均匀分布。 (C)2015 Elsevier B.V.保留所有权利。

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