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Influence of current density on the characteristics of diamond grains-nickel super-thin cutting blade fabricated by electrotyping

机译:电流密度对电铸金刚石-镍超薄切削刀片性能的影响

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摘要

Free-standing diamond grains-nickel composite films were deposited by using electrotyping method at the condition of low internal stress electrolytic solution. The effect of electric current density on the diamond grain concentration, surface morphology, microstrain (or lattice strain) and deposition rate of the film was studied. Scanning Electron Microscope (SEM) and X-Ray Diffraction (XRD) were used to analyse the characteristics of the films. It was found that the diamond grain concentration in the film varied with current density and approached to its maximum value when the current density was at the range of 1.3-2.5 A/dm~2. The microstrain in the film decreased from 0.36 to 0.28% with increase of the current density from 1.3 to 3.3 A/dm~2. The deposition rate of the film increased with an increase of current density. The film with the best possible density and uniformity was obtained at the current density range of 1.3-2.0 A/dm~2. The composite films obtained in this study can be used to make super-thin cutting blade for cutting Integrated Circuit (IC) silicon chips as well as other electronic devices.
机译:在低内应力电解液的条件下,通过电铸法沉积形成独立的金刚石晶粒-镍复合膜。研究了电流密度对金刚石晶粒浓度,表面形貌,微应变(或晶格应变)和薄膜沉积速率的影响。使用扫描电子显微镜(SEM)和X射线衍射(XRD)分析薄膜的特性。发现当电流密度在1.3-2.5A / dm〜2的范围内时,膜中金刚石晶粒的浓度随电流密度而变化,并接近最大值。随着电流密度从1.3 A / dm〜2增加,薄膜中的微应变从0.36降低到0.28%。膜的沉积速率随着电流密度的增加而增加。在1.3-2.0 A / dm〜2的电流密度范围内获得了具有最佳密度和均匀性的薄膜。在这项研究中获得的复合膜可用于制造用于切割集成电路(IC)硅芯片以及其他电子设备的超薄切割刀片。

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