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Dynamic actuation properties of TiNi shape memory diaphragm

机译:TiNi形状记忆膜片的动态驱动特性

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摘要

In order to realize a micropump with a shape memory alloy (SMA) diaphragm actuator, TiNi thin film of about 7 μm in thickness was deposited by flash evaporation and its dynamic deformation-shape recovery properties were studied using a bulge test. The TiNi diaphragm was deformed by applying a gas pressure of 200 kPa, heated resistively to recover its initial flat shape, and then air-cooled to achieve deformation once again. During this thermal cycle, temperature and deflection of the diaphragm were monitored at its center. In order to monitor temperature, we fabricated a Cu-Ni micro thermocouple on the diaphragm by conventional evaporation. When the diaphragm was heated, shape recovery occurred at about 60℃. This continued after the temperature for termination of reverse martensitic transformation, Af (about 70℃), had been reached. Moreover, when the diaphragm was air-cooled, redeformation began even at temperatures higher than that for the commencement of martensitic transformation, Ms (about 60℃). From a FEM simulation and temperature measurements taken using thermography, these results could be explained by the temperature gradient formed in the diaphragm due to thermal conduction. When heating rate was increased, time required to complete shape recovery decreased and maximum displacement for shape recovery increased. This could also be explained in terms of the temperature gradient.
机译:为了实现具有形状记忆合金(SMA)膜片致动器的微型泵,通过闪蒸沉积了厚度约为7μm的TiNi薄膜,并使用膨胀试验研究了其动态变形-形状恢复特性。通过施加200 kPa的气压使TiNi隔膜变形,电阻加热以恢复其初始平坦形状,然后进行空气冷却以再次实现变形。在该热循环期间,在膜片的中央监测膜片的温度和挠度。为了监测温度,我们通过常规蒸发在隔膜上制作了一个Cu-Ni微型热电偶。加热隔膜后,在约60℃时发生形状恢复。在达到终止马氏体相变的温度Af(约70℃)之后,这种情况继续进行。而且,在对膜片进行风冷时,即使在高于开始马氏体相变的温度Ms(约60℃)的温度下,也开始重新变形。从有限元模拟和使用热成像仪进行的温度测量中,这些结果可以用热传导在膜片中形成的温度梯度来解释。当加热速率增加时,完成形状恢复所需的时间减少,并且形状恢复的最大位移增加。这也可以用温度梯度来解释。

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