Electrostatic energy harvesting device with out-of-the-plane gap closing scheme

摘要

In this paper, we report on an electrostatic energy harvester with an out-of-the-plane gap closing scheme. Using advanced MEMS technology, energy harvesting devices formed by a four wafer stack are batch fabricated and fully packaged at wafer scale. A spin coated CYTOP polymer is used both as an electret material and an adhesive layer for low temperature wafer bonding. The overall size of the device is about 1.1 cm×: 1.3 cm. At an external load resistance of 13.4 M?, a power output of 0.15 μW is achieved when vibration at an acceleration amplitude of 1 g (~9.8m/s~2) is applied at a low frequency of 96Hz. The frequency response of the device is also measured and a broader bandwidth is observed at higher acceleration amplitude.