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In situ sintering bonding of oxide dispersion strengthened superalloys using pulsed electric current sintering technique

机译:脉冲电流烧结技术原位烧结结合氧化物弥散强化高温合金

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The in situ sintering bonding of oxide dispersion strengthened super alloys MA956 and MA754 was carried out using a pulsed electric current sintering (PECS) technique. Insert layers consisting of MA956 and MA754 powders were positioned between the respective bonding alloys, and PECS bonding was then carried out at 1023-1415 Kfor 0-64-8 ks applying a bonding pressure of 40-70 MPa. The number of pores between particles in the bond layer diminished with holding time. The densification behaviour of the bond layer during the PECS bonding process could be expressed by a kinetic equation with the sequential rate determining steps of plastic flow (creep) and volume diffusion. Transmission electron microscopy observations revealed that oxide strengthening particles of Y_2O_3 were dispersed finely and uniformly not only inside the powder particles but also at the prior particle boundaries. The creep rupture lives of MA956 and MA754 joints bonded at 1323 K for 54-0 ks and 1373 Kfor 64-8 ks were about 70 percent of that of the base metal in the longitudinal direction. The heat conduction analysis suggested that the rapid densification in PECS bonding could be attributed to the promotion of sintering by the local Joule heat generation (local increase in temperature) at the necked region. It was deduced that the superior mechanical properties of PECS bonded joints resulted from the fine and uniform dispersion of strengthening oxides in the bond layer.
机译:使用脉冲电流烧结(PECS)技术进行氧化物弥散强化超级合金MA956和MA754的原位烧结结合。将由MA956和MA754粉末组成的插入层放置在相应的粘结合金之间,然后在1023-1415 K下进行PECS粘结0-64-8 ks,施加40-70 MPa的粘结压力。结合层中的粒子之间的孔数随着保持时间而减少。 PECS粘结过程中粘结层的致密化行为可以通过动力学方程式来表示,该方程式具有确定塑料流动(蠕变)和体积扩散的顺序速率。透射电子显微镜观察表明,Y_2O_3的氧化物增强颗粒不仅在粉末颗粒内部而且还在先前的颗粒边界处精细且均匀地分散。 MA956和MA754接头在1323 K处粘结54-0 ks和1373 K处粘结64-8 ks的蠕变断裂寿命在纵向方向上约为母材的70%。导热分析表明,PECS键合的快速致密化可以归因于颈区局部焦耳热的产生(温度的局部升高)促进了烧结。可以推断出,PECS粘结接头的优异机械性能是由于增强氧化物在粘结层中的细微均匀分散所致。

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