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Characterization of sintered TiC-SiC composites

机译:烧结TiC-SiC复合材料的表征

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TiC-SiC composites were fabricated using TiC and SiC powders as starting materials at the range of 1650-2000 DEG C in Ar atmosphere by two-step method. In the first step, the ingots with intragranular SiC or TiC particle were prepared by arc-melting technique, subsequently, crushed and ground into TiC and SiC composite powders. In the second step, TiC-SiC composites were sintered using these as-prepared composite powders by SPS method. It was concluded that these TiC-SiC composites prepared by two-step method showed more excellent properties than that prepared by arc-melting technique. The hardness of the fabricated TiC-SiC composites was 25-27 GPa at the load of 0.98-9.8 N, which was obviously greater than that of arc-melting composites. The thermal conductivity of the TiC-SiC composites was 18-48 W K~(-1) m~(-1) at the range of 298-1273 K and slightly decreased with increasing temperature. The electrical conductivity of the composites was (2-5) X 10~5 S m~(-1)at the range of 298-1273 K and slightly decreased with increasing temperature.
机译:采用两步法,以TiC和SiC粉末为原料,在Ar气氛中于1650-2000℃范围内制备了TiC-SiC复合材料。第一步,通过电弧熔化技术制备出具有晶粒内SiC或TiC颗粒的铸锭,随后将其粉碎并研磨成TiC和SiC复合粉末。在第二步中,使用这些制备的复合粉末通过SPS方法烧结TiC-SiC复合材料。结论是,用两步法制备的这些TiC-SiC复合材料表现出比通过电弧熔化技术制备的更优异的性能。 TiC-SiC复合材料在0.98-9.8 N的载荷下的硬度为25-27 GPa,明显高于电弧熔化复合材料的硬度。 TiC-SiC复合材料的热导率在298-1273 K范围内为18-48 W K〜(-1)m〜(-1),并且随着温度的升高而略有降低。复合材料的电导率在298-1273 K范围内为(2-5)X 10〜5 S m〜(-1),随温度升高而降低。

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