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Electromagnetic characteristics of low-permittivity ceramics as substrates for mushroom-like high impedance surfaces

机译:低介电常数陶瓷作为蘑菇状高阻抗表面的基底的电磁特性

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The electromagnetic characteristics of low-permittivity ceramics, including silica, willemite, forsterite and alumina, as substrates for a mushroom-like high impedance surface (HIS) for enhancing microstrip patch antenna (MPA) performance from 1 to 6 GHz have been explored based on a parametric study evaluating the effects of ceramic substrate thickness and permittivity on resonance frequency and bandwidth of the HIS using the derived equations. To inhibit surface waves, the maximum thicknesses allowed for silica, willemite, forsterite and alumina substrates were determined for the first time when the resonance frequency of HIS matched with the operating frequency of MPA. For silica, forsterite and alumina, the thicknesses are 7.25, 5.57, 5.49 and 4.53 mm at 1 GHz, respectively, and decrease with increasing frequency in the range of 1 to 6 GHz. High impedance surfaces supported by silica, willemite, forsterite and alumina substrates exhibit bandwidths of 15.19%, 11.68%, 11.50% and 9.49%, respectively, independent of frequency. Silica, willemite and forsterite are good substrates for HISs with sufficient bandwidths. An alumina-supported HIS possesses a slightly smaller bandwidth but a more compact configuration which is favorable for antenna miniaturization. The use of low-permittivity ceramic substrates for the HIS can provide desirable electromagnetic properties while maintaining the proper dimensions to prevent surface waves. (C) 2014 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
机译:在以下基础上,探索了低介电常数陶瓷的电磁特性,包括二氧化硅,硅铝石,镁橄榄石和氧化铝,它们用作蘑菇状高阻抗表面(HIS)的基材,以增强1至6 GHz的微带贴片天线(MPA)性能。使用导出的方程评估陶瓷基板厚度和介电常数对HIS共振频率和带宽的影响的参数研究。为了抑制表面波,当HIS的共振频率与MPA的工作频率相匹配时,首次确定了二氧化硅,硅铝石,镁橄榄石和氧化铝基材的最大厚度。对于二氧化硅,镁橄榄石和氧化铝,其厚度在1 GHz时分别为7.25、5.57、5.49和4.53 mm,并且在1至6 GHz范围内随着频率的增加而减小。由二氧化硅,硅藻土,镁橄榄石和氧化铝基材支撑的高阻抗表面的带宽分别为15.19%,11.68%,11.50%和9.49%,与频率无关。二氧化硅,硅藻土和镁橄榄石是具有足够带宽的HIS的良好基材。氧化铝支撑的HIS具有稍小的带宽,但结构更紧凑,有利于天线的小型化。将低介电常数陶瓷基板用于HIS可以提供​​所需的电磁性能,同时保持适当的尺寸以防止表面波。 (C)2014 Elsevier Ltd和Techna Group S.r.l.版权所有。

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