Studies on surface deformation of copper sulphide thin films by holographic interferometry technique

摘要

Holographic interferometry technique used to study the surface deformation of electrodeposited copper sulphide thin films on stainless steel substrate is here presented. It is concerned with the formation and interpretation of fringe patterns, which appears when a wave generated at some earlier time and stored in a hologram is later reconstructed by interfering with comparison wave. The proposed technique uses double exposure holographic interferometry (DEHI) together with simple mathematical relation, which allows immediate finding of stress, mass deposited and thickness of thin film. It must be further noted that, fringe spacing changes with time of deposition as well as solution concentration. The structural study (XRD) is carried out for the confirmation.