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首页> 外文期刊>Oncology letters >PIAS3 promotes homology-directed repair and distal non-homologous end joining
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PIAS3 promotes homology-directed repair and distal non-homologous end joining

机译:PIAS3促进同源性导向的修复和远端非同源末端连接

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A DNA double-strand break (DSB) is the most severe form of DNA damage and is mainly repaired through homologous recombination (HR), which has a high fidelity, or non-homologous end joining (NHEJ), which is prone to errors. Defects in the DNA damage response lead to genomic instability and ultimately the predisposition of organs to cancer. Protein inhibitor of activated STAT-1 (PIAS1), which is a potential small ubiquitin-related modifier (SUMO) ligase, has been reported to be involved in DSB repair. The present study identified that another member of the PIAS family, PIAS3, is also an enhancer for HR- and NHEJ-mediated DSB repair. Furthermore, the overexpression of PIAS3 was demonstrated to increase the resistance of HeLa cells to ionizing radiation (IR), indicating a significant role for PIAS3 in the DNA damage response (DDR) pathway.
机译:DNA双链断裂(DSB)是最严重的DNA损伤形式,主要通过具有高保真度的同源重组(HR)或易于出错的非同源末端连接(NHEJ)进行修复。 DNA损伤反应的缺陷会导致基因组不稳定,并最终导致器官易患癌症。据报道,活化的STAT-1(PIAS1)蛋白抑制剂是一种潜在的小泛素相关修饰剂(SUMO)连接酶,参与了DSB修复。本研究确定了PIAS家族的另一个成员PIAS3也是HR和NHEJ介导的DSB修复的增强剂。此外,PIAS3的过表达被证明可以增加HeLa细胞对电离辐射(IR)的抵抗力,表明PIAS3在DNA损伤反应(DDR)途径中具有重要作用。

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