首页> 外文期刊>Revue de l'electricite et de l'electronique >The integration of EMC constraints in the design of high-density logic integrated circuits
【24h】

The integration of EMC constraints in the design of high-density logic integrated circuits

机译:在高密度逻辑集成电路设计中集成EMC约束

获取原文
获取原文并翻译 | 示例
       

摘要

A method of reducing the level of interference transmitted as voltage variations on the input, output and supply connections to integrated circuits (ICs) has been developed. The method is applicable to all types of digital ICs including high-density circuit substrates. The method analyses the analogue behaviour of the IC and simulates the interference source as two current generators, one on the VDD supply (ivdd) and one on the VSS ground connection (ivss). The method therefore takes account of the entire supply circuit including the IC package, the decoupling network and the supply connections themselves. The simulation calculates the resulting noise level on the input, output and supply connections to the IC.
机译:已经开发出一种减小随着集成电路(IC)的输入,输出和电源连接上的电压变化而传输的干扰电平的方法。该方法适用于包括高密度电路基板的所有类型的数字IC。该方法分析了IC的模拟行为,并将干扰源模拟为两个电流发生器,一个在VDD电源(ivdd)上,一个在VSS接地(ivss)上。因此,该方法考虑了包括IC封装,去耦网络和电源连接本身在内的整个电源电路。该模拟计算输入到IC的输入,输出和电源连接上的噪声水平。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号