Physical Simulation Study of the Dynamic Recrystallization Kinetics of an Ni-Cu-Al Alloy

摘要

The influence of temperature and deformation on the dynamic recrystallization kinetics of an Ni-30Cu-3Al heat-resistant alloy has been studied on the basis of experiments using a torsion plastometer. The process is simulated and mathematical model is proposed for estimating the dynamically recrystallized grain sizes. Good agreement between the calculated and experimental data is achieved.