Investigation of the processing dependence of SL solidification residual stresses

摘要

This paper presents an experimental study undertaken to determine the polymerisation-induced residual stresses generated in stereolithography (SL) built test specimens, by using the hole-drilling strain gage method of stress relaxation. Experimentally measured strains, using special three-element strain gage rosettes, were input into the blind-hole analysis to calculate the induced residual stresses. The mechanical properties of resin specimens fabricated by the solidification process using an epoxy based photopolymer and post-cured under ultraviolet (Uy) and thermal exposure were determined and incorporated into the subsequent drill-hole analysis. The effect of the pre-selected fabrication parameters (hatching space and curing depth) and subsequent by the post-curing procedure (UV, thermal curing) on the magnitude of the recorded strains is also presented.