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A tolerant slicing algorithm for layered manufacturing

机译:分层制造的公差切片算法

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This paper proposes a tolerant slicing algorithm for processing slice contours for Layered Manufacturing (LM). The algorithm aims to overcome the constraints of computer memory and the computation instability commonly inherent in conventional slicing methodologies. It minimizes memory usage by adopting a pick-and-drop approach, which extracts one facet for slicing from the Stereolithography (STL) file at a time. The facets that intersect with the cutting plane are read in, sliced and then disposed of from the memory one by one for subsequent construction of slice contours. Only the slice data and the associated topological information of the current layer are temporarily stored in the memory. This approach greatly reduces the amount of computer memory required and it involves much less computationally intensive searching operations. Thus, STL models of virtually unlimited ifie size can be sliced to facilitate the LM processes. The algorithm is also relatively fault-tolerant in that common defects of STL models may be tolerated and the resultant inconsistent contours are effectively repaired.
机译:提出了一种用于分层制造(LM)的切片轮廓公差处理算法。该算法旨在克服传统切片方法通常固有的计算机内存限制和计算不稳定性。通过采用拖放方法,该方法可最大程度地减少内存使用,该方法一次从立体光刻(STL)文件中提取一个面进行切片。与切面相交的小面被读取,切片,然后从存储器中逐一处理,以便随后构造切片轮廓。仅切片数据和当前层的相关拓扑信息被临时存储在存储器中。这种方法大大减少了所需的计算机内存量,并且涉及的计算量更少。因此,几乎无限大小的STL模型可以切片以促进LM过程。该算法也是相对容错的,因为可以容忍STL模型的常见缺陷,并且可以有效地修复由此产生的不一致轮廓。

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