Numerical simulation of heat dissipation from a plastic ball grid array package in a thin flat box: Effects of some operative and geometric parameters

摘要

This article concerns the numerical simulation method of heat transfer in a compact system box housing the assembly of a 672-pin plastic ball grid array (PBGA) package and a printed circuit board (PCB). A computational model for the PBGA/PCB assembly was developed to account for complex phenomena of three-dimensional heat and fluid flow, and conjugate heat transfer in tiny package components. Simulation results for a sample parameter set were compared with experimental data, and their agreement was confirmed. Then, the modeling approach was applied to a wide range of the parameter domain and effects of some operative and geometric parameters were investigated.