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The variation of microstructure in Czochralski silicon induced by low-high two step anneal

机译:低高两步退火诱导的直拉硅微观结构变化

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摘要

Systematic low-high two-step and high-low-high three-step annealing studies were conducted to investigate the microdefects generated in Czochralski silicon wafers. It was found that cluster precipitates entangled with dislocations are annihilated during extended low temperature anneal. A model involving the recombination of vacancies with interstitials is proposed to explain this phenomenon. (C) 1998 American Institute of Physics. References: 15
机译:通过系统的低-高两步和高-低-高三步退火研究,研究了直拉硅片中产生的微缺陷。研究发现,在延长的低温退火过程中,纠缠着位错的团簇沉淀物被湮灭。提出了一种涉及空缺与插页式广告重组的模型来解释这一现象。(C) 1998年美国物理研究所。[参考资料: 15]

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