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Design, simulation, production and initial characterisation of3D silicon detectors

机译:3D硅探测器的设计、仿真、生产和初始表征

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摘要

3D detectors are photodiode radiation detectors with n- and p-type electrode columns passing througha silicon substrate. This structure makes it possible to achieve a very small electrode spacing withoutreducing the sensitive thickness. This greatly reduces the detector's depletion voltage and collectiontime, and hence improves its radiation hardness. This could make 3D detectors useful as pixel detectorsfor future high-luminosity colliders, such as the Super-LHC.The research institute IMB-CNM (Centro Nacional de Microelectronica, Barcelona) have produced 3Dpad, pixel and strip detectors with a "double-sided 3D" structure. This fabrication has been donealongside design and simulation work at the University of Glasgow. The first devices produced by CNMhave been successfully IV and CV tested, and source tests are ongoing. Additionally, this conferencerecord discusses work done by other 3D detector collaborations: Stanford, Manchester University andSintef; FBK (Trento); and Glasgow, Diamond Light Source and IceMOS Ltd.
机译:3D探测器是光电二极管辐射探测器,其n型和p型电极柱穿过硅衬底。这种结构可以在不减少敏感厚度的情况下实现非常小的电极间距。这大大降低了探测器的耗尽电压和收集时间,从而提高了其辐射硬度。这可能使3D探测器成为未来高光度对撞机(如超级大型强子对撞机)的像素探测器。研究所IMB-CNM(巴塞罗那国家微电子中心)生产了具有“双面3D”结构的3Dpad,像素和条形探测器。这种制造是在格拉斯哥大学的设计和模拟工作中完成的。CNM生产的首批设备已成功通过IV和CV测试,源测试正在进行中。此外,本会议记录还讨论了其他 3D 探测器合作所做的工作:斯坦福大学、曼彻斯特大学和 Sintef;FBK(特伦托);以及格拉斯哥、Diamond Light Source 和 IceMOS Ltd。

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