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3D laterolog array sonde design and response simulation

机译:3D侧向阵列探测仪设计与响应仿真

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摘要

A new three-dimensional laterolog array sonde (3D-LS) is presented. The 3D-LS is based on existing high-resolution laterolog array and azimuthal resistivity imaging sondes with radial, longitudinal, and circumferential detection abilities. Six investigation modes are designed using the 3D finite-element method and different investigation depths are simulated based on the pseudo-geometrical factor of the six modes. The invasion profile is described using multi-array radial logs. From the analysis of the pseudo-geometrical factor, the investigation depth of the 3D-LS is about 1.5 m for conductive invasion, which is close to that of the dual laterolog tool but greater than that of the highly integrated azimuthal laterolog sonde. The vertical and azimuthal resolution is also analyzed with the same method. The 3D-LS can detect low-resistivity anomalies of 0.5 m thickness and 15 degrees around the borehole for infinitely thick formations. This study lays the foundation for more work on 3D laterolog array sonde for evaluating low-resistivity anomalies.
机译:提出了一种新的三维侧向测仪阵列探测仪(3D-LS)。3D-LS基于现有的高分辨率侧向测井阵列和方位电阻率成像探测仪,具有径向、纵向和圆周探测能力。采用三维有限元方法设计了6种调查模式,并基于6种模式的伪几何系数模拟了不同的调查深度。使用多阵列径向日志描述入侵配置文件。从伪几何因子分析可以看出,3D-LS的导电侵入调查深度约为1.5 m,接近双侧测仪工具,但大于高度集成的方位角侧测仪。垂直和方位角分辨率也用相同的方法进行分析。3D-LS可以探测到钻孔周围0.5米厚度和15度的低电阻率异常,以发现无限厚的地层。这项研究为用于评估低电阻率异常的三维侧测仪探测仪的更多工作奠定了基础。

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