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首页> 外文期刊>Microwave and optical technology letters >INVESTIGATION OF INTERCONNECT LOSS DUE TO COUPLING BETWEEN TWO PARALLEL MICROSTRIP LINES IN HIGH-SPEED DESIGN
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INVESTIGATION OF INTERCONNECT LOSS DUE TO COUPLING BETWEEN TWO PARALLEL MICROSTRIP LINES IN HIGH-SPEED DESIGN

机译:高速设计中两条平行微带线耦合引起的互连损耗研究

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Loss due to coupling between two parallel microstrip lines is investigated in this paper. It is found that the transmission characteristic of the aggressor line was impaired by coupling. Most energy would be coupled to the victim line at resonant frequencies determined by the space between traces and the coupled length, which seriously affects the transmitted signals with high data rate. Two coupled microstrip lines are analyzed in terms of even and odd modes to explain this additional loss mechanism. Several design parameters are simulated. It is clearly shown that resonant frequencies increase with the space between traces and decrease with the coupled length. Electromagnetic simulations are also performed to illustrate this extra loss mechanism. Good agreement is seen between analytical and experimental analyses.
机译:本文研究了两条平行微带线之间的耦合造成的损耗。发现干扰线的传输特性由于耦合而受损。大多数能量将以由走线之间的空间和耦合长度确定的共振频率耦合到受害线,这会严重影响以高数据速率传输的信号。根据偶数和奇数模式分析了两条耦合的微带线,以解释这种额外的损耗机制。模拟了几个设计参数。清楚地表明,谐振频率随走线之间的间距而增加,而随耦合长度而降低。还进行了电磁仿真来说明这种额外的损耗机制。在分析和实验分析之间可以看到很好的一致性。

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