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Quasi-static analysis of microstriplines with variable-thickness substrates considering finite metallization thickness

机译:考虑有限金属化厚度的可变厚度衬底微带线的准静态分析

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This Letter presents an extension of the method of lines (MOL) to the analysis of microstriplines with variable-thickness substrates with the use of the quasi-static approximation. Discretization lines of varying length, according to the layer thickness, are used. Only Laplace wave equation have to be solved. The numerical results presented here permit illustration of the effect of arbitrary curved interfaces on the considered structures. As an example, the characteristic impedance, the capacitance PUL, the inductance PUL, and the effective dielectric constant are computed as a function of different shape characteristics of these microstripline structures. The effect of metallization thickness is also included in the analysis. The results show good agreement with data available in the literature.
机译:这封信提出了线方法(MOL)的扩展,使用准静态近似法来分析具有可变厚度底物的微带线。根据层的厚度,使用不同长度的离散化线。仅需求解拉普拉斯波动方程。此处提供的数值结果可以说明任意弯曲界面对所考虑结构的影响。例如,根据这些微带线结构的不同形状特征来计算特征阻抗,电容PUL,电感PUL和有效介电常数。分析中还包括金属化厚度的影响。结果表明与文献中的数据有很好的一致性。

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