ANALYSIS OF FREQUENCY RESPONSE OF WIRE BOND CONFIGURATIONS JOINING TWO 50-X MICROSTRIP LINES

摘要

Small to medium length wirebond interconnects, which range approximately from 300 to 660 lm are investigated. Wirebond S-parameters are measured using a parametric vector network analyzer with respect to a 50-Ω system. Results show that there is degrading performance with increasing wirebond length and decreasing number of bonds.