A NEW INSPECTION METHOD APPLYING TO CMOS IMAGE SENSOR BUMPING

摘要

This article demonstrates a new optical technique, which we apply to the collimating system to measure the parallel degree of CMOS (Complementary Metal-Oxide Semiconductor) image sensor bumping. We research and develop the new adjustable auto-collimating system to simplify the testing of CMOS board alignment and to increase the image quality of the cell phone camera. This method is a non-contact method for testing and can detect the parallel degree deviation to an accuracy of 0.5°.