A DUAL-BAND BALANCED AMPLIFIER USING THREE-LAYER TECHNOLOGY

摘要

A multilayer technology is applied to design a dual-band branch-line coupler for the dual-band balanced amplifier. The proposed coupler is designed based on a three-layer printed circuit board. The dual-band operation is achieved by four additional shunt stubs at the middle layer, while the upper layer is the core and active circuits layer and the bottom is ground layer. The proposed coupler with equal power division is designed at two frequencies of 1.1 and 1.9 GHz. Besides, a balanced amplifier is also designed which achieves gain of 11.6 and 10.1 dB at 1.1 and 1.9 GHz, respectively.