Stereolithography can be used to fabricate 3-D and high aspect ratio microstructures with low manufacturing cost and short fabrication time. Stereo lithography can customize the packages for microfluidics and microsensors to eliminate the dead volume of the reaction chamber. Fabrication of MEMS packages on a wafer level scale can decrease the manufacturing time and assembly time. In order to show the feasibility of integration of stereolithography with micromachined devices, alignment, cleaning, and dicing tests have been investigated. Stereolithography was applied to chemical sensors, interdigitated electrodes, and an AFM cantilever fluid cell package. After the cleaning process the devices were tested and passed a functional test.
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