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Influence of tool fabrication process on characteristics of hot embossed polymer microfluidic chips for electrospray

机译:工具制造工艺对热压印聚合物电喷雾微流控芯片性能的影响

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摘要

Fabrication techniques for mass manufacture of disposable polymer microfluidic chips are important for electrospray application used in mass spectrometry. Hot embossing offers advantages over traditional MEMS fabrication techniques and is the focus of this research. The aim of the paper is to evaluate hot embossed open channel polymer chips using two different hot embossing tools. One tool was fabricated in nickel using the electroforming process, and the other in high carbon bright steel by laser machining technique using a pulsed Nd:YAG laser that is normally used for conventional applications. Process parameters are determined and measurement of dimensions and surface roughness of tools and chips are presented. Depending on the fabrication method, each tool exhibits its own characteristic profile feature and surface roughness. Polystyrene and polycarbonate substrates embossed with the electroformed tool exhibited lowest surface roughness of 48 nm compared to 450 nm for the laser machined tool. The embossed microfluidic chips were tested for fluid flow and electrospray and showed good performance.
机译:大规模生产一次性聚合物微流控芯片的制造技术对于质谱中使用的电喷雾应用很重要。热压纹比传统的MEMS制造技术更具优势,并且是本研究的重点。本文的目的是使用两种不同的热压印工具来评估热压印明通道聚合物芯片。一种工具是使用电铸工艺在镍中制造的,另一种工具是通过使用脉冲Nd:YAG激光(通常用于常规应用)的激光加工技术在高碳光亮钢中制造的。确定工艺参数,并给出工具和切屑的尺寸和表面粗糙度的测量值。根据制造方法的不同,每种工具都具有自己的特征轮廓特征和表面粗糙度。压印有电铸工具的聚苯乙烯和聚碳酸酯基材的最低表面粗糙度为48 nm,而激光加工工具的表面粗糙度为450 nm。对压花的微流体芯片进行了流体流动和电喷雾测试,并显示出良好的性能。

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