首页> 外文会议>Conference on micro- and nanotechnology: Materials, processes, packaging, and systems IV; 20081210-12; Melbourne(AU) >Electrospray from hot embossed polymer microfluidic chips formed using laser machined and electroformed tools
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Electrospray from hot embossed polymer microfluidic chips formed using laser machined and electroformed tools

机译:使用激光加工和电铸工具形成的热压花聚合物微流控芯片电喷雾

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摘要

The aim of this project was to develop high performance polymer microfluidic chips with reduced complexity for Electrospray Ionization Mass Spectrometry (ESI-MS) analysis. This paper presents the fabrication and testing of developed hot embossed open channel polymer microfluidic chips for ESI-MS. Hot embossing was done using a laser machined steel tool and an electroformed nickel tool on polystyrene (PS) and polycarbonate (PC) substrates. Stable electrosprays were generated at microchannel exits of replicated microchips without cover using a high voltage difference between a positive stainless steel electrode in the reservoir and a negative aluminum plate. Electrospray parameters such as; nozzle tip distance from counter electrode, ESI onset potential and duration were investigated. For open channel systems, the results show that the electric field for stable ES directly relates to the distance between the channel tip and counter electrode, onset potential applied and to the flow velocity of the test solution in the microchannel. Fluid is delivered as a result of electroosmosis due to an applied electric field and capillary action, thereby eliminating the need for external pressure devices. From experimental results, for an open-channel of 100μm width, 100μm depth, length 12.5mm attached to an open reservoir of diameter 2 mm, the optimum distance between the channel exit tip and counter electrode is 1.2 mm for initiation of electrospray at voltage of ~2000 volts. The laser machined steel tool was found to be more durable than the nickel tool for PS/PC microstructure fabrication.
机译:该项目的目的是开发具有降低复杂性的高性能聚合物微流控芯片,用于电喷雾电离质谱(ESI-MS)分析。本文介绍了用于ESI-MS的热压印明通道聚合物微流控芯片的制造和测试。使用激光加工的钢工具和电铸镍工具在聚苯乙烯(PS)和聚碳酸酯(PC)基材上进行热压花。在储液罐中的正极不锈钢电极和负极铝板之间使用高电压差,在没有覆盖的复制微芯片的微通道出口处产生稳定的电喷雾。电喷雾参数如;研究了喷嘴尖端与反电极的距离,ESI起始电位和持续时间。对于明通道系统,结果表明,稳定ES的电场直接与通道尖端和反电极之间的距离,施加的起始电势以及微通道中测试溶液的流速有关。由于施加的电场和毛细作用,电渗导致流体被输送,从而消除了对外部压力装置的需求。根据实验结果,对于宽度为100μm,深度为100μm,长度为12.5mm的开放通道连接到直径为2mm的开放式储液罐,在电压为时启动电喷雾时,通道出口尖端与反电极之间的最佳距离为1.2mm。 〜2000伏发现用于PS / PC微结构制造的激光加工钢工具比镍工具更耐用。

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