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Bonding of planar poly(methyl methacrylate) (PMMA) nanofluidic channels using thermal assisted ultrasonic bonding method

机译:使用热辅助超声键合方法键合平面聚甲基丙烯酸甲酯(PMMA)纳米流体通道

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摘要

Because of extremely small dimensions of nanochannels and low rigidity of polymer, most bonding techniques which are suitable for sealing polymer micro-scale channels (width and depth in tens to hundreds microns) are not competent for bonding of polymer nanochannels. In this study, a new thermal assisted ultrasonic bonding method for sealing poly(methyl methacrylate) (PMMA) nanochannels was presented. Substrates were preheated to 30-40℃ lower than glass transition temperature (T_g) of the material by hot plate. Then low amplitude ultrasonic vibration was employed to generate facial heat at the interface of the substrates. Influences of preheating temperature on bonding strength and dimension loss were studied. The nanochannels were successfully bonded with depth loss less than 5.3% (10.6 nm) and bonding strength of 0.21 J/cm~2 at the preheating temperature of 70℃. Thermal assisted ultrasonic bonding is proven to be competent for bonding of polymer nanochannels with high bonding strength, low dimension loss and short bonding time.
机译:由于纳米通道的尺寸非常小且聚合物的刚性低,因此大多数适用于密封聚合物微米级通道(宽度和深度在数十至数百微米)的粘合技术都不能胜任聚合物纳米通道的粘合。在这项研究中,提出了一种用于密封聚甲基丙烯酸甲酯(PMMA)纳米通道的新型热辅助超声粘合方法。通过热板将基材预热至比材料的玻璃化转变温度(T_g)低30-40℃。然后,采用低振幅超声振动在基板的界面处产生面热。研究了预热温度对粘结强度和尺寸损失的影响。在70℃的预热温度下,纳米通道的深度损失小于5.3%(10.6 nm),结合强度为0.21 J / cm〜2,成功地结合了纳米通道。事实证明,热辅助超声键合能够以高键合强度,低尺寸损失和短键合时间来粘合聚合物纳米通道。

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