Technology and application of electro-depositable photo resists to create uniform coatings needed for complex 3D micro actuators and sensors

摘要

Electro-depositable photo resists, which have been developed for printed circuit board industry (PCB), are recently receiving great attention in MEMS technology. This paper reports on the technology needed and its application for patterning 3D microstructures with high aspect ratios and large structure heights. Adapted equipment for coating structured and non-structured wafers is introduced. The optimized process technology obtained by a multitude of parameter variations is described-providing the application engineer with a means to produce pin hole free uniform coatings on arbitrary geometries, which may be structured with high resolution and allow high aspect ratios. The technology was adapted to several applications, which show the big potential for the development of micro actuators and sensors. This paper focuses on the utilization for electroplating conductors, which are part of a micro actuator based on a helical coil.