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The key to control Cu II loading in silica based mesoporous materials

机译:控制二氧化硅基介孔材料中Cu II含量的关键

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Cu II loading on porous silica surfaces has been shown in the past to be easy to perform but no precise control on the amount of copper loaded has been elucidated. Here, controlled Cu II loading can be accomplished at ambient temperature in a reaction time of 10 min for loadings of 6-20% Cu (w/w). Analysis by UV-visible spectroscopy of copper uptake in SBA-15 materials has shown that the pH of the solution and the consequent complexation of the Cu II cation dictates the amount of Cu (II) impregnation. The key to the success of this control is the presence of the [Cu(NH3)3(H2O)3]~(2+) complex in the reaction solution. FT-IR, diffuse reflectance UV-visible spectroscopy, N2 adsorption, TEM (transmission electronic microscopy) and SAXS (small angle X-ray scattering) analyses were performed on the obtained SBA-15 Cu materials illustrating a well dispersed Cu (II) covering of the SBA-15 surface.
机译:过去已经表明,在多孔二氧化硅表面上负载Cu II易于执行,但尚未阐明对负载铜量的精确控制。在此,对于6-20%Cu(w / w)的负载量,可以在环境温度下以10分钟的反应时间完成受控的Cu II负载量。通过紫外可见光谱法对SBA-15材料中铜的吸收进行的分析表明,溶液的pH值和随之而来的Cu II阳离子络合决定了Cu(II)的浸渍量。控制成功的关键是在反应溶液中存在[Cu(NH3)3(H2O)3]〜(2+)配合物。对获得的SBA-15 Cu材料进行了FT-IR,漫反射紫外可见光谱,N2吸附,TEM(透射电子显微镜)和SAXS(小角度X射线散射)分析,显示了良好分散的Cu(II)覆盖层SBA-15表面。

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