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首页> 外文期刊>Micron: The international research and review journal for microscopy >In situ ultra-high vacuum transmission electron microscopy studies of the transient oxidation stage of Cu and Cu alloy thin films
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In situ ultra-high vacuum transmission electron microscopy studies of the transient oxidation stage of Cu and Cu alloy thin films

机译:Cu和Cu合金薄膜瞬态氧化阶段的原位超高真空透射电镜研究

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Because environmental stability is an essential property of most engineered materials, many theories exist to explain oxidation mechanisms. Yet, nearly all classical oxidation theories assume a uniform growing film, where structural changes were not considered because of the previous lack of experimental procedure to visualize this non-uniform growth in conditions that allowed for highly controlled surfaces and impurities. With the advent of vacuum technologies and advances in microcopy techniques, especially in situ, one can now see structural changes under controlled surface conditions. Here, we present a review of our systematic studies on the transient oxidation stages of a model metal system, Cu, and its alloys, Cu-Au and Cu-Ni, by in situ ultra-high vacuum transmission electron microscopy (UHV-TEM). The dependence of the oxidation behavior on the crystal orientation, oxygen pressure, temperature and alloying is attributed to the structures of the oxygen-chemisorbed layer, oxygen surface diffusion, surface energy and the interfacial strain energy. Heteroepitaxial concepts, developed to explain thin film formation on a dissimilar substrate material (e.g., Ge on Si), described well these initial oxidation stages.
机译:由于环境稳定性是大多数工程材料的基本属性,因此存在许多理论来解释氧化机理。但是,几乎所有经典的氧化理论都假设薄膜均匀生长,由于先前缺乏在高度可控的表面和杂质条件下可视化这种不均匀生长的实验程序,因此未考虑结构变化。随着真空技术的出现和显微技术的发展,特别是在原位,现在人们可以在受控的表面条件下看到结构的变化。在这里,我们通过原位超高真空透射电子显微镜(UHV-TEM)对模型金属系统Cu及其合金Cu-Au和Cu-Ni的瞬态氧化阶段的系统研究进行了综述。 。氧化行为对晶体取向,氧气压力,温度和合金化的依赖性归因于氧气化学吸附层的结构,氧气表面扩散,表面能和界面应变能。为了解释在不同的衬底材料(例如,Si上的Ge)上的薄膜形成而发展的异质外延概念很好地描述了这些初始氧化阶段。

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