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Interfacial Phenomena and Joint Strength in Resistance Microwelding of Crossed Au-Plated Ni Wires

机译:交叉镀金镍丝电阻微焊的界面现象和接头强度

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Resistance microwelding (RMW) of crossed Au-plated Ni wires has been performed at welding currents from 250 to 800 A and welding times from 1 to 80 ms under 4-kg welding force. The interfacial phenomena and the joint breaking force were investigated using an optical microscope (OM), a scanning electron microscope (SEM), an energy-dispersive X-ray (EDX) spectroscope, and a tensile-shear test. The results showed that mechanisms of joint formation involve brazing at low welding current, brazing and solid-state bonding at medium welding current, and solid-state bonding and fusion welding at high welding current. The joint breaking force first increased with increasing welding current, and after reaching a peak value, subsequently decreased due to recrystallization and softening of the Ni wire. With Au plating on the wire surfaces, the joint breaking force was remarkably improved. Comparisons among the RMW of Au-plated Ni wires, Au-plated Ni sheets, and bare Ni wires are also discussed.
机译:交叉镀金镍丝的电阻微焊接(RMW)在4千克焊接力下以250至800 A的焊接电流和1至80 ms的焊接时间进行。使用光学显微镜(OM),扫描电子显微镜(SEM),能量色散X射线(EDX)光谱仪和拉伸剪切试验研究了界面现象和接头断裂力。结果表明,接头形成机理包括低焊接电流下的钎焊,中焊接电流下的钎焊和固态键合,高焊接电流下的固态键合和熔焊。接头断裂力首先随着焊接电流的增加而增加,在达到峰值后,由于镍丝的再结晶和软化而减小。通过在导线表面镀金,可以显着提高接头断裂力。还讨论了镀金镍丝,镀金镍片和裸露镍丝的RMW之间的比较。

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