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首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >Hydrogen embrittlement, grain boundary segregation, and stress corrosion cracking of alloy X-750 in low and high-temperature water
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Hydrogen embrittlement, grain boundary segregation, and stress corrosion cracking of alloy X-750 in low and high-temperature water

机译:X-750合金在低温和高温水中的氢脆,晶界偏析和应力腐蚀开裂

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摘要

The nature of intergranular stress corrosioncracking (SCC) of alloy X-750 was characterized in low-andhigh-temperature water by testing as-notched and precrackedfracture mechanics specimens. Materials given the AH, BH, andHTH heat treatments were studied. While all heat treatmentswere susceptible to rapid low-temperature crack propagation(LTCP) below 150 0C, conditions AH and BH were particularlysusceptible. Low-temperature tests under various loadingconditions (e.g., constant displacement, constant load, andincreasing load) revealed that the maximum stress intensityfactors (Kpmax) from conventional rising load tests provideconservative estimates of the critical loading conditions inhighly susceptible heats, regardless of the load path history. Forresistant heats, Kpmax provides a reasonable, but notnecessarily conservative, estimate of the critical stress intensityfactor for LTCP. Testing of as-notched specimens showed thatLTCP will not initiate at a smooth surface or notch, but willreadily occur if a cracklike defect is present. Comparison of thecracking response in water with that for hydrogen-prechargedspecimens tested in air demonstrated that LTCP is associatedwith hydrogen embrittlement of grain boundaries. Equivalentactivation energies for stage II LTCP rates (11.3 kcal/mol) andhydrogen diffusion (11.5 kcal/mol) indicate that hydrogendiffusion to the peak stress region ahead of a crack is the rate-controlling process. Auger analysis showed that variability inLTCP resistance is associated with phosphorus and sulfursegregation to grain boundaries. Above 150 0C, an increase infracture resistance and decrease in the degree of hydrogenenrichment precludes rapid intergranular cracking. The stresscorrosion crack initiation and growth does occur in high-temperature water (>250 0C), but crack growth rates are ordersof magnitude lower than LTCP rates. The SCC resistance ofHTH heats is far superior to that of AH heats as crack initiationtimes are two to three orders of magnitude greater and growthrates are one to two orders of magnitude lower.
机译:X-750合金的晶间应力腐蚀开裂(SCC)的性质通过测试缺口和预开裂的断裂力学试样在低温和高温水中进行表征。研究了经过AH,BH和HTH热处理的材料。虽然所有热处理都容易受到低于150 0C的快速低温裂纹扩展(LTCP)的影响,但条件AH和BH尤其敏感。在各种载荷条件下(例如,恒定位移,恒定载荷和载荷增加)的低温测试表明,常规的上升载荷试验的最大应力强度因子(Kpmax)提供了对高度敏感的热中的临界载荷条件的保守估计,而与载荷路径历史无关。对于耐热性,Kpmax提供了合理但不必要的LTCP临界应力强度因子的估计值。缺口试样的测试表明,LTCP不会在光滑表面或缺口处引发,但如果存在裂纹状缺陷,则很容易发生。将水中的裂纹反应与在空气中测试的预充氢样品的裂纹响应进行比较,结果表明LTCP与晶界的氢脆有关。 II级LTCP速率(11.3 kcal / mol)和氢扩散(11.5 kcal / mol)的等效活化能表明,氢扩散至裂纹前的峰值应力区域是速率控制过程。俄歇分析表明,LTCP抗性的变化与磷和硫偏析到晶界有关。高于150 0C时,抗断裂强度的增加和氢富集程度的降低将阻止快速的晶间开裂。在高温水中(> 250 0C)确实发生了应力腐蚀裂纹的萌生和扩展,但裂纹扩展速率比LTCP速率低几个数量级。 HTH加热器的SCC电阻远优于AH加热器,因为裂纹萌生时间要大2到3个数量级,而生长速率则要低1到2个数量级。

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