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Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly

机译:汽相焊接用于改善半导体热发生器(TEG)组件的质量

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The processing of harvested waste heat obtained from industrial or domestic installations directly converted into electrical energy using thermoelectric generators (TEG) is an interesting and future-proof solution. The TEG generator involves the serial connection of even tens of p-n thermocouples, through which a current of even a dozen amperes can flow. Its reliability strongly depends also on the quality of the solder joints, especially on the types of solder alloys, their quality, the soldering techniques applied and other factors. An additional difficulty is the functioning of thermogenerators and their solder joints at high temperature of up to several hundred degrees Celsius and with large temperature gradients between cold and hot plates. This paper presents the technical results of research investigation of semiconductor TEG model with particular reference to the technological aspects of the solder joint performances. Two types of solder pastes with different compositions and melting temperatures were examined. The main soldering method used was vapour phase soldering (VPS). VPS uses the latent heat of liquid vaporization to provide heat for soldering. A vacuum option during the soldering process was also applied. The results showed that the number of voids is strongly dependant on alloy composition and the presence of the vacuum. (C) 2014 Elsevier Ltd. All rights reserved.
机译:使用热电发电机(TEG)处理从工业或家庭设施中直接获取的电能收集的废热,是一种有趣且面向未来的解决方案。 TEG发生器涉及甚至数十个p-n热电偶的串联连接,甚至数十安培的电流也可通过该热电偶流过。其可靠性在很大程度上还取决于焊点的质量,特别是取决于焊锡合金的类型,质量,所采用的焊接技术以及其他因素。另一个困难是热发生器及其焊点在高达几百摄氏度的高温下以及冷热板之间的温度梯度较大时的功能。本文介绍了半导体TEG模型研究的技术成果,并特别参考了焊点性能的技术方面。研究了两种具有不同成分和熔化温度的焊膏。使用的主要焊接方法是气相焊接(VPS)。 VPS利用液体汽化潜热为焊接提供热量。在焊接过程中也采用了真空选项。结果表明,空隙的数量在很大程度上取决于合金成分和真空的存在。 (C)2014 Elsevier Ltd.保留所有权利。

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