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首页> 外文期刊>Materials Science and Technology: MST: A publication of the Institute of Metals >Study on preparation of Co-Pt-W alloy films by electrodeposition
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Study on preparation of Co-Pt-W alloy films by electrodeposition

机译:电沉积制备Co-Pt-W合金薄膜的研究

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摘要

Co-Pt-W alloy films were prepared by the electroplating method to replace costly sputtering on a copper substrate. Effects of different pH values and current densities on composition, microstructure and magnetic properties of films were investigated. With the rise in pH values, the amounts of tungsten and cobalt decrease simultaneously as a result of less tungstate oxides in higher OH- concentration solution. Almost all the deposited films were crystalline and formed fcc CoPt(111) and hcp CoPt(002). Co-Pt-W alloy films intend to change from fcc to hcp structure when the current density was >20 mA cm~(-2). It was found that hcp structures of Co-Pt-W alloy films possess high coercivity performance. Moreover, higher pH values induced lower saturation magnetisation while higher current densities could result in larger saturation magnetisation. Dissimilar surface morphology could be detected under different current densities. With increasing the current density, grains of films tend to agglomerate and grow perpendicularly to substrate. Bigger agglomerated particles and 'hill-like' structure could be observed when the current density was up to 30 mA cm~(-2).
机译:通过电镀方法制备了Co-Pt-W合金膜,以代替在铜基板上昂贵的溅射。研究了不同pH值和电流密度对薄膜组成,微观结构和磁性的影响。随着pH值的升高,钨和钴的含量同时下降,这是因为在较高OH浓度的溶液中钨酸盐的氧化物较少。几乎所有的沉积膜都是结晶的,形成了fcc CoPt(111)和hcp CoPt(002)。当电流密度> 20 mA cm〜(-2)时,Co-Pt-W合金薄膜打算从fcc转变为hcp结构。发现Co-Pt-W合金膜的hcp结构具有高矫顽力性能。此外,较高的pH值会引起较低的饱和磁化强度,而较高的电流密度可能会导致较大的饱和磁化强度。在不同的电流密度下可以检测到不同的表面形态。随着电流密度的增加,薄膜的晶粒易于团聚并垂直于基板生长。当电流密度达到30 mA cm〜(-2)时,可以观察到更大的团聚颗粒和“山丘状”结构。

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