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High-quality n-type aluminum gallium nitride thin films grown by interrupted deposition and in-situ thermal annealing

机译:通过中断沉积和原位热退火生长的高质量n型氮化铝镓薄膜

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摘要

High quality Si-doped n-Al0.6Ga0.4N thin films were grown on sapphire substrates by molecular beam epitaxy (MBE) by interrupted deposition and subsequent in-situ thermal annealing (IDTA). High-resolution X-ray diffraction, scanning electron microscope, atomic force microscope, photoluminescence and Hall-effect measurements were carried out to characterize the structural, electrical and optical properties. The results showed that the full width at half-maximum of the Si-doped Al0.6Ga0.4N (0002) was as low as 160 arcsec. The threading dislocation density decreases two orders of magnitude to 6 x 1107 cm(-2) by using the IOTA technology. The carrier density and mobility reached at 1.1 x 10(19) cm(-3) and 4.8 cm(2)/V s, respectively. Si still acted as a shallow donor even for the heavily doped Al0.6Ga0.4N. (C) 2014 Elsevier Ltd. All rights reserved.
机译:通过中断沉积和随后的原位热退火(IDTA),通过分子束外延(MBE)在蓝宝石衬底上生长高质量的掺Si的n-Al0.6Ga0.4N薄膜。进行了高分辨率的X射线衍射,扫描电子显微镜,原子力显微镜,光致发光和霍尔效应测量,以表征结构,电学和光学性质。结果表明,掺Si的Al0.6Ga0.4N(0002)的半峰全宽低至160弧秒。通过使用IOTA技术,螺纹位错密度降低了两个数量级,降至6 x 1107 cm(-2)。载流子密度和迁移率分别达到1.1 x 10(19)cm(-3)和4.8 cm(2)/ V s。即使对于重掺杂的Al0.6Ga0.4N,Si仍充当浅施主。 (C)2014 Elsevier Ltd.保留所有权利。

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