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High Cycle Fatigue Properties of a Minor Boron-Modified Ti-6Al-4V Alloy

机译:少量硼改性的Ti-6Al-4V合金的高循环疲劳性能

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Ti-6Al-4V alloys modified with minor amounts of boron (B) were prepared, and two types of microstructures, a full lamellar microstructure and an equiaxed microstructure, were generated through combinations of hot-deformation and heat treatments. The beneficial effect of adding a minor amount of B in refining microstructures was confirmed in as-cast ingots and a full lamellar microstructure. For example, a refined prior β grain size of about 100 μm in diameter was obtained for the 0.1 mass percent B-modified alloy with a full lamellar microstructure: accordingly, the size of each colony within the grains was reduced. Contrary to this, equiaxed microstructures with α grain sizes of about 8 μm were obtained for both B-free and B-modified alloys. The room temperature high cycle fatigue (HCF) strength of the B-modified alloys increased compared to the B-free alloy for both microstructures. For example, HCF strength at 10~7 cycles for the alloy with an equiaxed microstructure increased to 750 MPa by the addition of 0.1 % B from 650 MPa for B-free alloy. The fatigue crack was found to originate neither from the TiB/matrix interface nor from the TiB itself but rather from the shear fractures across microstructural units such as colonies or spherical α phases. The reduced colony size and the retarding effect of TiB against the movement of the fatigue initiation area were thought to be responsible for the improved HCF properties of Ti-6Al-4V with lamellar and equiaxed microstructures, respectively.
机译:制备了用少量硼(B)改性的Ti-6Al-4V合金,通过热变形和热处理相结合,产生了两种类型的组织,即全层状组织和等轴组织。在铸态铸锭和完整的层状微结构中证实了在精炼微结构中添加少量B的有益效果。例如,对于具有完整层状微结构的0.1质量%B改性合金,可以获得直径约为100μm的精炼先验β晶粒尺寸:因此,晶粒内每个菌落的尺寸都减小了。与此相反,对于无B合金和B改性合金,均获得了具有约8μm的α晶粒尺寸的等轴组织。对于两种微观结构,B-改性合金的室温高循环疲劳(HCF)强度均高于无B合金。例如,通过添加无硼合金的650 MPa的0.1%B,具有等轴组织的合金的10-7个循环的HCF强度增加到750 MPa。发现疲劳裂纹既不起源于TiB /基体界面,也不起源于TiB本身,而是起源于整个微结构单元(例如菌落或球形α相)的剪切断裂。 TiB减少的菌落大小和对疲劳起始区域移动的阻滞作用被认为是分别改善了具有层状和等轴微结构的Ti-6Al-4V的HCF性能的原因。

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