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首页> 外文期刊>Materials and Corrosion >Void formation and filling under alumina scales formed on Fe-20Cr-5Al based alloys and coatings, oxidised at temperatures up to 1200℃
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Void formation and filling under alumina scales formed on Fe-20Cr-5Al based alloys and coatings, oxidised at temperatures up to 1200℃

机译:在Fe-20Cr-5Al基合金和涂层上形成的氧化铝鳞片上形成的空洞和填充,在高达1200℃的温度下被氧化

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摘要

During the oxidation, in laboratory air, of thin foils of Fe-20Cr-5Al based alloys, voids were formed in the substrate beneath the outer protective alumina scale after times varying from 50 h at 900℃ to 10 min at 1200℃. Once the substrate aluminium level had dropped below a critical value (≤0.5 wt%), it no longer sustained the alumina scale formation and, as a consequence, continuing oxidation resulted in the initiation and development of a Cr-rich oxide sub-layer formation. At the lower temperatures, the voids filled with chromia leading to a scallop-shaped inner layer beneath the alumina scale. In contrast, at higher temperatures, the Cr-rich sub-scale layer was continuous. If the Fe-20Cr-5Al based alloys are deposited as coatings, for example as a compliant layer onto a stronger substrate, there is a risk that other elements (such as silicon) from the substrate may diffuse through the coating and influence the subsequent oxidation behaviour of the coating. In order to simulate this, sandwiches of Fe-Cr-Al and a silicon rich substrate were fabricated and tested over a range of oxidation temperatures. It was then found that the silicon did indeed diffuse through the Fe-Cr-Al layer and change the oxidation mechanism. The voids formed under the alumina were now found to contain silicon oxide rather than chromia, but the void filling mechanism also appeared to be different. With chromia filled voids the filling commenced from the alumina scale, with the oxide growing inwards, while the silica rich regions grew outwards into the voids from the substrate. Scanning electron microscopy and EDX analysis were used to follow these changes and those in other more complex situations. Detailed mechanisms for void and chromia sub-scale formation and development will be discussed in the paper.
机译:在实验室空气中,Fe-20Cr-5Al基合金薄箔的氧化过程中,在900℃下的50 h至1200℃下的10 min的时间变化后,在外部保护性氧化铝鳞片下方的基材中形成了空隙。一旦基材的铝含量降至临界值(≤0.5wt%)以下,它将不再维持氧化铝垢的形成,因此,持续的氧化导致富铬氧化物亚层的形成和发展。 。在较低的温度下,充满氧化铬的空隙会导致氧化铝鳞片下方的扇贝形内层。相反,在较高的温度下,富Cr的氧化皮层是连续的。如果将Fe-20Cr-5Al基合金作为涂层(例如,作为顺应层)沉积到坚固的基材上,则存在来自基材的其他元素(例如硅)可能扩散穿过涂层并影响后续氧化的风险涂层的行为。为了模拟这一点,制造了Fe-Cr-Al和富硅衬底的三明治,并在一定的氧化温度范围内对其进行了测试。然后发现,硅确实确实通过Fe-Cr-Al层扩散并改变了氧化机理。现在发现在氧化铝下面形成的空隙包含氧化硅而不是氧化铬,但是空隙填充机理也似乎是不同的。用氧化铬填充的空隙从氧化铝垢开始填充,其中氧化物向内生长,而富含二氧化硅的区域从基材向外生长到空隙中。使用扫描电子显微镜和EDX分析来跟踪这些变化以及其他更复杂情况下的变化。本文将讨论空隙和色度亚标形成和发展的详细机制。

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