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首页> 外文期刊>Ferroelectrics: Letters Section >MECHANISM AND CONTROLLING OF SILVER MIGRATION IN COFIRED MULTILAYER DEVICES WITH AG-PD INNER ELECTRODES
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MECHANISM AND CONTROLLING OF SILVER MIGRATION IN COFIRED MULTILAYER DEVICES WITH AG-PD INNER ELECTRODES

机译:AG-PD内电极在多层多层膜中银迁移的机理与控制

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The silver migration in cofired multilayer ceramic devices with Ag-Pd electrodes has been a serious concern for their reliability and electrical properties with much thinner tapes produced. This paper presents the investigation on the mechanism of silver migration by cofiring experiments between PMZNT ceramics and Ag-Pd electrodes. The results showed that the rapid transport of silver near the interface was basically attributed to vapor-phase diffusion mechanism. Silver in electrodes could migrate into the ceramics via open pores on the surface of ceramics in the early period of sintering. The interfacial diffusion of silver could be restricted by modified compositions and sintering processes.
机译:银烧结在带有Ag-Pd电极的共烧多层陶瓷器件中,其可靠性和电学性能受到人们的严重关注,所生产的带材更薄。本文通过PMZNT陶瓷与Ag-Pd电极之间的共烧实验研究了银迁移的机理。结果表明,界面附近银的快速迁移主要归因于气相扩散机理。烧结初期,电极中的银可能会通过陶瓷表面上的开孔迁移到陶瓷中。银的界面扩散可能受到改性成分和烧结工艺的限制。

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