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Simple solderability testing of package on package (PoP) devices

机译:简单的封装式(PoP)装置可焊性测试

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摘要

Some subcontractors have been asked to build stacked packages where customers do not have a dipping process for PoP assembly or are not confident with the process. They have felt more comfortable with the prestacking process being undertaken first. Solderability testing of stacked packages that have already been through a prestacking process can be fairly simple to perform. The test may also be applied to single parts prior to stacking or parts due to be stacked. The test method is subjective but can prove very effective, and with care, the tested components do not necessarily need to be scrapped.
机译:一些分包商被要求建造堆叠包装,其中客户没有用于PoP组装的浸涂工艺或对该工艺不满意。他们对先进行预堆放过程感到更加自在。已经进行了预堆叠过程的堆叠式包装的可焊性测试可以非常简单地执行。该测试还可以应用于堆叠之前的单个零件或将要堆叠的零件。该测试方法是主观的,但可以证明非常有效,并且谨慎对待,不必废弃报废的组件。

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