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首页> 外文期刊>Microelectronics and reliability >Physical and electrical properties of low dielectric constant self-assembled mesoporous silica thin films
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Physical and electrical properties of low dielectric constant self-assembled mesoporous silica thin films

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The physical and electrical properties of self-assembled mesoporous silica thin films with defined 2D hexagonal porous architectures have been evaluated in the following study. Self-assembled mesoporous silica thin (MPS) films have been prepared by evaporationinduced self-assembly (EISA) methods using the triblock copolymer (C_2H_2)_(106)(C_3H_3)_(70)(C_2H_2)_(106) (Pluronic F127~reg;). The MPS films exhibit remarkably low level leakage currents (1 × 10~(-8)1 × 10~(-7) A/cm~2 at 1 MV/cm~1) and high breakdown voltages (>3 MV/cm~1). The films have dielectric constants of approximately 2.3, low dielectric loss factors of 0.01-0.03 and exhibit negligible frequency dispersion of dielectric constant between 100 kHz and 1 MHz. The effect of physisorbed water (humidity) upon the electrical properties of the films is also investigated using capacitance-voltage techniques.

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