首页> 外文期刊>European journal of orthodontics >Influence of light dose on bond strength of orthodontic light-cured adhesives
【24h】

Influence of light dose on bond strength of orthodontic light-cured adhesives

机译:光剂量对正畸光固化胶粘剂粘结强度的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Although the polymerization reaction in light-cured orthodontic adhesive continues for some time after light irradiation, it is unclear whether insufficiently irradiated adhesive develops sufficient bond strength. This in vitro study examined the maturation of bond strength after exposure of a variety of light doses. Large metal brackets were bonded to the enamel of 288 bovine mandibular incisors by irradiation at two light intensities (200 and 400 mW/cm 2) and for three exposure times (3, 5, and 10 seconds) using three orthodontic adhesives (TB, OP, and BOB). Shear bond strengths and adhesive remnant indices (ARI s) were determined immediately (T1) and 24 hours after bonding (T2 ; n = 8 in each group). Comparisons were made using the Kruskal - Wallis H -test, the Bonferroni-corrected Mann - Whitney U - test, and the Yates-corrected chi-square test. Bond strengths of the adhesives that showed maturation at low light intensity (200 mW/cm 2) increased by 1.4 - to 2.0-fold in 24 hours . An increase in exposure time increased bond strength more than did an increase in light intensity for most orthodontic adhesives. With an exposure time of 3 seconds at 200 mW/cm 2, the ARI scores of TB and OP differed significantly between T1 and T2. Thus, the most acceptable procedure when applying low-dose light intensity to a bracket before the placement of a wire is to increase the exposure time and/or wait for sufficient maturation of bond strength.
机译:尽管在光照射后光固化正畸粘合剂中的聚合反应持续了一段时间,但是尚不清楚辐照不足的粘合剂是否会形成足够的粘合强度。这项体外研究检查了各种光剂量暴露后粘合强度的成熟度。通过使用三种正畸粘合剂(TB,OP)以两种光强度(200和400 mW / cm 2)辐照并暴露三个时间(3、5和10秒),将大型金属托板粘结到288个牛下颌切牙的牙釉质上和BOB)。立即测定(T1)和粘结后24小时(T2;每组n = 8),测定剪切粘结强度和粘结残余指数(ARI s)。使用Kruskal-Wallis H-检验,Bonferroni校正的Mann-Whitney U-检验和Yates校正的卡方检验进行比较。在低光强度(200 mW / cm 2)下表现出成熟度的粘合剂的粘合强度在24小时内增加了1.4到2.0倍。对于大多数正畸粘合剂,增加曝光时间增加的粘合强度比增加光强度增加的粘合强度更多。在200 mW / cm 2的曝光时间为3秒的情况下,T1和T2之间的TB和OP ARI得分显着不同。因此,在放置导线之前向支架施加低剂量的光强度时,最可接受的过程是增加曝光时间和/或等待键合强度充分成熟。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号