New non-destructive laser ablation based backside sample preparation method

摘要

A new ultra-short pulse laser ablation based backside sample preparation method has been developed. This technique is contact-less, non-thermal, precise, repetitive and adapted to each type of material present in IC packages. Backside preparation examples are presented on a conventional DIL plastic package, a TSOP plastic package with an oversized silicon die and on a DIL ceramic package.