The smaller, higher-density chip packages offer increased performance and reduce the size of the assembly, but introduce complications into quality assurance. Many of these ICs have hidden solder joints. Just using AOI or electrical test is no longer sufficient. X-ray inspection seems the best tool to check these locations. However, those in-line configurations are expensive and hard to program, while off-line gear is suited for samples. The alternative is the combination of vision and X-ray providing the benefits of both technologies without sacrificing throughput or time.
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