...
首页> 外文期刊>Microelectronics and reliability >Impact of advanced processing modules on the low-frequency noise performance of deep-submicron CMOS technologies
【24h】

Impact of advanced processing modules on the low-frequency noise performance of deep-submicron CMOS technologies

机译:

获取原文
获取原文并翻译 | 示例

摘要

Fundamental studies related to the low-frequency (LF) noise performance in semiconductors started more than 40 years ago. In 1957, McWhorter published the first model for the 1/f noise in semiconductors, which is still in use. Whereas for many decades LF noise studies were mainly of fundamental and theoretical interests, in recent years, LF noise characterisation has become a very valuable diagnostic technique for the development of semiconductor materials and devices. Especially, the use of noise characterisation as a tool for reliability predictions has triggered the semiconductor engineering society. Not only the silicon starting material, but also many of the used process modules have a strong impact on the noise performance. This trend is becoming even more pronounced for the advanced deep-submicron technologies. For analog applications of scaled technologies, LF noise may even act as a showstopper. This review, therefore, focuses on the impact of advanced processing on the low-frequency noise behaviour. Both front- and back-end process modules are discussed.

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号