Structural characteristics of titanium coating on copper substrates

摘要

The growth characteristics of titanium films deposited on glass, silicon (100) and oxygen free high purity copper substrate using magnetron sputtering have been investigated using X-ray diffraction, electron microscopy and scratch indentation techniques. The study of interface between the titanium film and the substrate was carried out to determine coating thickness, as well as intermixing of the elements at the interface. Studies revealed that the interface is free from voids and intermixing of the film and the substrate. Microstructural and diffraction analysis showed that the Ti coating was polycrystalline and exhibited columnar growth. The Ti crystallite size varied between 24 and 58 nm depending on the substrate. The thickness of the films were typically about 4 urn. Scratch test indicated that the films are adherent and the first critical load to failure was observed to be 4.5 N ± 2 N.