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首页> 外文期刊>Environmental microbiology >Mechanism of copper surface toxicity in Escherichia coli O157:H7, Salmonella involves immediate membrane depolarization followed by slower rate of DNA destruction which differs from that observed for Gram-positive bacteria
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Mechanism of copper surface toxicity in Escherichia coli O157:H7, Salmonella involves immediate membrane depolarization followed by slower rate of DNA destruction which differs from that observed for Gram-positive bacteria

机译:沙门氏菌在大肠杆菌O157:H7中铜表面毒性的机制涉及立即进行膜去极化,随后DNA破坏速率降低,这与革兰氏阳性细菌观察到的不同

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We have reported previously that copper I and II ionic species, and superoxide but not Fenton reaction generated hydroxyl radicals, are important in the killing mechanism of pathogenic enterococci on copper surfaces. In this new work we determined if the mechanism was the same in non-pathogenic ancestral (K12) and laboratory (DH5α) strains, and a pathogenic strain (O157), of Escherichia coli. The pathogenic strain exhibited prolonged survival on stainless steel surfaces compared with the other E. coli strains but all died within 10min on copper surfaces using a 'dry' inoculum protocol (with approximately 10 ~7cfucm ~(-2)) to mimic dry touch contamination. We observed immediate cytoplasmic membrane depolarization, not seen with enterococci or methicillin resistant Staphylococcus aureus, and loss of outer membrane integrity, inhibition of respiration and in situ generation of reactive oxygen species on copper and copper alloy surfaces that did not occur on stainless steel. Chelation of copper (I) and (II) ionic species still had the most significant impact on bacterial survival but protection by d-mannitol suggests hydroxyl radicals are involved in the killing mechanism. We also observed a much slower rate of DNA destruction on copper surfaces compared with previous results for enterococci. This may be due to protection of the nucleic acid by the periplasm and the extensive cell aggregation that we observed on copper surfaces. Similar results were obtained for Salmonella species but partial quenching by d-mannitol suggests radicals other than hydroxyl may be involved. The results indicate that copper biocidal surfaces are effective for Gram-positive and Gram-negative bacteria but bacterial morphology affects the mechanism of toxicity. These surfaces could not only help to prevent infection spread but also prevent horizontal gene transmission which is responsible for the evolution of virulent toxin producing and antibiotic resistant bacteria.
机译:先前我们已经报道过,铜I和II离子物种以及超氧化物而不是Fenton反应生成的羟基自由基在铜表面致病性肠球菌的杀灭机制中很重要。在这项新工作中,我们确定了大肠杆菌的非致病祖传(K12)和实验室(DH5α)菌株以及致病菌株(O157)的机制是否相同。与其他大肠杆菌菌株相比,该病原菌株在不锈钢表面表现出延长的存活期,但所有细菌均使用“干”接种方案(约10〜7cfucm〜(-2))模仿干接触污染,在铜表面上均在10分钟内死亡。 。我们观察到立即的细胞质膜去极化,肠球菌或耐甲氧西林的金黄色葡萄球菌未见,外膜完整性丧失,呼吸抑制和原位生成铜和铜合金表面上的活性氧物种,这是不锈钢所没有的。铜(I)和(II)离子物种的螯合仍然对细菌存活具有最重要的影响,但d-甘露醇的保护表明羟基自由基参与了杀伤机制。我们还观察到铜表面上DNA破坏的速率与先前肠球菌的检测结果相比要慢得多。这可能是由于周质对核酸的保护以及我们在铜表面观察到的广泛的细胞聚集所致。沙门氏菌获得了相似的结果,但用d-甘露糖醇部分淬灭表明可能涉及除羟基以外的其他自由基。结果表明,铜杀生物表面对革兰氏阳性和革兰氏阴性细菌有效,但细菌形态会影响毒性机理。这些表面不仅可以帮助防止感染传播,还可以防止水平基因传播,而水平基因传播负责产生有毒毒素和抗生素抗性细菌。

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