Improved thermal modelling of magnetic components for power electronics

摘要

An improved thermal modelling of convection and radiation heat transfer for magnetic components for power electronics is presented. The proposed model of convection heat transfer uses more precise values of the exponents in the presentation of the convection coefficient h{sub}c as well as a reduced surface of the component. The model for radiation includes precise values of the emissivity of the component surface and also a reduced 'envelope' surface. Accurate thermal measurements of two experimental models (box shape and transformer shape, size EE42) were done for four different kinds of surfaces of the models to derive and verify the proposed models. The improved models can be used in cm accurate thermal design of magnetic components.