Three-dimensional singular stress field near the interfacial bond line of a tapered jointed plate either free-standing (notch) or (fully/partially) attached to a super-rigid inclusion (antinotch)

摘要

A three-dimensional eigenfunction expansion approach is employed for determining singular stress fields in the vicinity of interfacial bond line of a tapered jointed plate either free-standing (notch) or (fully/partially) attached to a super-rigid inclusion (antinotch). The tapered jointed bi-material plate is subjected to extension/bending (mode 1) and shear/twisting (mode II) far field loading (extension and shear being in the plane of the cross-section and bending/twisting about mid-width). Hitherto unavailable results, pertaining to the width-wise variations of stress intensity factors corresponding to symmetric and skew-symmetric (about mid-width) cosine function loads, in the vicinity of the interfacial bond line, are presented.